Ultrasonic Sputtering Target Bonding Machine
Ultrasonic Sputtering Target Bonding Machine
Hoặc gửi yêu cầu tư vấn:
Chi tiết sản phẩm
Ultrasonic Sputtering Target Bonding Machine is widely used for soldering various kinds of sputtering targets such as ITO, Al, Mo, Cr, Si and so on without flux.
MECS TECH’s high ultrasonic soldering technology offers Rotary Sputtering Targets Bonding Machine as well.
Application
- Sputtering Target & Backing Plate Bonding
Thông số kỹ thuật
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Model No. |
MR-1030C |
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Ultrasonic Frequency |
30 KHz ± 1 KHz |
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Maximum Output |
1000 Watt |
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Temperature Range |
150 ~ 500 °C |
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Power Supply |
220V / 50-60 Hz |
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Ultrasonic Generator |
Size |
435(W) x 600(L) x 140(H) mm |
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Weight |
20 Kg |
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Feature |
Ultrasonic Amplitude Adjustable |
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Iron Handle Length & Diameter |
340mm / Ø45 |
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Avail Soldering Matrial |
ITO Glass, AL, Mo, Cu etc., |
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Video
VIDEO : Ultrasonic Sputtering Target Bonding Machine
VIDEO : Ultrasonic Cylindrical Sputtering Target Bonding Machine
VIDEO : Ultrasonic Bonding Machine for Sputtering Target
